Vorrichtungen und Verfahren zur Verbesserung der Wärmeleitung von Smt und Chip-On-Board-Komponenten zum Chassiswärmesenke
Anmelder: Hamilton Sundstrand Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4262327
- Aktenzeichen
- EP23167737
- Anmeldetag
- 13. April 2023
- Veröffentlichung
- 18. Oktober 2023
- Rechtsraum
- EP
- IPC
- H05K1/02// H05K3/00
Abstract
Circuit board assemblies (100) include a circuit board portion (110) having a recess formed therein, an electrically and thermally conductive insert (120), shaped to fit in the recess formed in the circuit board portion (110), an electrically and thermally conductive layer (140) adapted and configured to interface with an external chassis (190), and a thermally conductive electrically insulative portion (130) interposed between the electrically and thermally conductive insert (120) and the electrically and thermally conductive layer (140), adapted and configured to conduct heat from the electrically and thermally conductive insert (120) to the electrically and thermally conductive layer without conducting electricity.
Anmelder
- Firma
- Hamilton Sundstrand Corporation
- Land
- 🇺🇸 USA
US-amerikanisches Unternehmen der Luft- und Raumfahrtindustrie, das Flugzeugsysteme wie Umweltkontroll-, Energie- und Antriebssysteme entwickelt; heute Teil von Collins Aerospace innerhalb von RTX.
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