Pin-Lamelle-Kühlung für Leiterplatten (pcb)

Details

Veröffentlichungs-Nr.

EP4340551

Aktenzeichen

EP23197759

Anmeldetag

15. September 2023

Veröffentlichung

30. Juli 2025

Erteilung

30. Juli 2025

Rechtsraum

EP

IPC

H05K1/02H01L21/48H01L23/367H01L23/473H05K3/46H05K3/00H05K1/05H05K7/20// H05K1/14

Abstract

Direct pin-fin cooling assemblies (100) are disclosed for a high-power printed circuit boards (PCBs) (102). The disclosure can solve the classical coldplate problem associated with liquid cooling of high-power PCBs (102), namely: (1) Inhomogeneous cooling due to the calorimetric heating up of the coolant (116), (2) thermal interface material (TIM) related quality issues such as dry-out effects, (3) high cost due to complicated metal coldplate structure, and (4) low thermal conductivity due to multi-layer structure. This includes incorporating pin-fin direct cooling into high-power PCB structures without additional coldplate structure or TIM. In this approach, a TIM and a top plate of coldplate can be removed. Thus, the cooling performance can be improved because the thermal conductivity between a liquid coolant (116) and a power device is increased.

Anmelder

Firmen

Hamilton Sundstrand Corporation
RTX Corporation

Land

🇺🇸 USA

Fachgebiete