Halbleitergehäuse zur Reduzierung der Grösse des Halbleitergehäuses

Details

Veröffentlichungs-Nr.

EP4379787

Aktenzeichen

EP23168314

Anmeldetag

17. April 2023

Veröffentlichung

5. Juni 2024

Rechtsraum

EP

IPC

H01L23/00

Abstract

A semiconductor package includes a substrate, a semiconductor device, and a stiffener. The substrate has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the substrate. The stiffener is disposed on the bottom surface of the substrate. The stiffener may be disposed on a perimeter portion of the bottom surface of the substrate, and may not be disposed on a central portion of the bottom surface of the substrate. One or more connection components may disposed on the central portion of the bottom surface of the substrate, and a thickness of the stiffener may be greater than or equal to a thickness of the one or more connection components.

Anmelder

Firma

Juniper Networks, Inc.

Land

🇺🇸 USA

Fachgebiete