Leiterplatte mit Eingebauten Komponenten

Details

Veröffentlichungs-Nr.

EP4380320

Aktenzeichen

EP23212561

Anmeldetag

28. November 2023

Veröffentlichung

5. Juni 2024

Rechtsraum

EP

IPC

H05K1/02// H05K1/18H05K3/46H01L23/538

Abstract

s: a first conductive wiring layer (10); a second conductive wiring layer (20) stacked on the first conductive wiring layer (10); an insulating layer (30) formed between the first conductive wiring layer (10) and the second conductive wiring layer (20); at least one pair of semiconductor elements built in the insulating layer (30) and each including a first electrode terminal and a second electrode terminal. The first electrode terminal (41) of a first semiconductor element (40), which is one of the pair of the semiconductor elements, is connected to the first conductive wiring layer (10), the second electrode terminal (52) of a second semiconductor element (50), which is the other of the pair of semiconductor elements, is connected to the second conductive wiring layer (20), and the first conductive wiring layer (10) and the second conductive wiring layer (20) are formed such that a current flowing through the first conductive wiring layer (10) and a current flowing through the second conductive wiring layer (20) are symmetrical and opposite when viewed from a direction passing through the first conductive wiring layer (10) and the second conductive wiring layer (20).

Anmelder

Firma

Nabtesco Corporation

Land

🇯🇵 Japan

Fachgebiete