Kühlsystem für Leistungselektronik

Details

Veröffentlichungs-Nr.

EP4398691

Aktenzeichen

EP24150882

Anmeldetag

9. Januar 2024

Veröffentlichung

10. Juli 2024

Rechtsraum

EP

IPC

H05K7/20

Abstract

A cooling system (60) for cooling one or more heat-generating devices (62), wherein the system (60) includes a heat sink to which the one or more heat-generating devices (62) are thermally coupled and a heat exchanger (100) thermally coupled to the heat sink. The heat exchanger (100) has a first flow path for receiving a primary cooling fluid (C1) and a second flow path for receiving a secondary cooling fluid (C2). Heat is transferable to the primary cooling fluid (C1) from both the heat sink and the secondary cooling fluid (C2) at the heat exchanger (100).

Anmelder

Firma

Carrier Corporation

Land

🇺🇸 USA

Fachgebiete