Systeme und Verfahren zum Waferchipmontagebonden

Details

Veröffentlichungs-Nr.

EP4406914

Aktenzeichen

EP24153916

Anmeldetag

25. Januar 2024

Veröffentlichung

31. Juli 2024

Rechtsraum

EP

IPC

B81C3/00G01L9/00

Abstract

A wafer die assembly includes a first wafer (102) having at least a central cavity (106) defined therein. The wafer die assembly includes a second wafer (112) mounted to the first wafer. At least one of the first or second wafers includes an etched pattern (104). The etched pattern including at least one peripheral cavity (108), and a raised area (110) raised relative to the peripheral cavity. A method of assembling a wafer die assembly includes etching a central cavity into a first wafer and etching a pattern into at least one of the first wafer or a second wafer. The first wafer and/or the second wafer includes a raised area raised relative to the peripheral cavity or the central cavity. The method includes bonding the second wafer to the first wafer.

Anmelder

Firma

ROSEMOUNT AEROSPACE INC.

Land

🇺🇸 USA

Fachgebiete