Hybrides Multichip-Qfp-Qfn-Gehäuse

Details

Veröffentlichungs-Nr.

EP4425537

Aktenzeichen

EP24159904

Anmeldetag

27. Februar 2024

Veröffentlichung

25. September 2024

Rechtsraum

EP

IPC

H01L21/48H01L23/495

Abstract

A hybrid QFN and QFP integrated circuit package includes a leadframe with first second die pads supporting first and second integrated circuits, respectively. The leadframe further includes QFN conductive pads QFP conductive leads. A package housing encapsulates the first and second die pads, the first and second integrated circuits mounted thereto, the QFN conductive pads, and proximal ends of the QFP conductive leads. Distal ends of the QFP conductive leads extend away from side edges of the package housing. Bottom surfaces of the QFN conductive pads are exposed at a bottom surface of the package housing. The QFN conductive pads are located between the first and second die pads.

Anmelder

Firma

STMicroelectronics International N.V.

Land

🇨🇭 Schweiz

Fachgebiete