Substratversiegelungskonfigurationen und -Verfahren

EP4427674 Art A1 11. September 2024

Anmelder: Medtronic MiniMed, Inc., MEDTRONIC MINIMED, INC. 🇺🇸

Details

Veröffentlichungs-Nr.
EP4427674
Aktenzeichen
EP24161121
Anmeldetag
4. März 2024
Veröffentlichung
11. September 2024
Rechtsraum
EP
IPC
A61B5/145
Offizieller Volltext

Abstract

A sensor device includes a housing configured to be secured to a patient and a seal structure located within the housing. A sensor probe having at least one substrate is supported by the housing. The substrate has a first length portion and a second length portion. The first length portion is external to the housing and is configured to be inserted into the patient when the housing is secured to the patient. The second length portion is in or on the housing and has a section that extends through the seal structure. That section has at least one side edge having an undulating edge pattern that enhances a seal effect of the seal structure at the section of the second length portion of the at least one substrate. The undulating edge pattern may be an edge wave pattern having a plurality of peaks or a plurality of valleys.

Anmelder

Firmen
Medtronic MiniMed, Inc.
MEDTRONIC MINIMED, INC.
Land
🇺🇸 USA
🇺🇸 Medtronic

US-amerikanischer Medizintechnikkonzern, entwickelt Implantate, Geräte und Therapiesysteme unter anderem für Herz-Kreislauf-, Diabetes- und neurologische Erkrankungen.

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