Piezoresistiver Hochtemperaturdrucksensor und Verpackungsanordnung dafür
Anmelder: ROSEMOUNT AEROSPACE INC. 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4428091
- Aktenzeichen
- EP24161954
- Anmeldetag
- 7. März 2024
- Veröffentlichung
- 18. Dezember 2024
- Rechtsraum
- EP
- IPC
- B81B3/00
Abstract
A packaged pressure sensor assembly is disclosed that includes a pressure sensor (100, 200) including an upper substrate and a lower substrate bonded to one another by way of a first glass frit having a first bonding temperature, so as to define a hermetically sealed pressure sensing chamber therebetween, and a housing defining an internal cavity having a base with a support surface for supporting the pressure sensor (100, 200), wherein the pressure sensor (100, 200) is bonded to the support surface of the base by a second glass frit having a second bonding temperature that is lower than the first bonding temperature.
Anmelder
- Firma
- ROSEMOUNT AEROSPACE INC.
- Land
- 🇺🇸 USA
US-amerikanisches Unternehmen, Teil von Collins Aerospace. Rosemount Aerospace entwickelt Sensoren und Messsysteme für Luftfahrzeuge, unter anderem für Luftdaten und Vereisungserkennung.
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