Hybrides Quad-Flat-No-Leads (qfn)-Integriertes Schaltungsgehäuse

Details

Veröffentlichungs-Nr.

EP4439659

Aktenzeichen

EP24163723

Anmeldetag

15. März 2024

Veröffentlichung

9. Oktober 2024

Rechtsraum

EP

IPC

H01L23/495H01L21/56H01L23/538

Abstract

A hybrid QFN package includes an encapsulant body that encapsulates a lead frame and integrated circuit (IC) device where the lead frame includes a die pad and vertically offset leads. Back sides of the die pad and encapsulant body are coplanar at first surface. Front sides of the leads, the IC device and the encapsulant body are substantially coplanar at a second surface. An insulating layer covers the second surface except at a portion of the leads located at the peripheral edge of the encapsulating body. Vias extend through the insulating layer to the leads and IC device. Wiring lines on the insulating layer interconnect the vias. A passivation layer covers the wiring lines and vias.

Anmelder

Firma

STMicroelectronics International N.V.

Land

🇨🇭 Schweiz

Fachgebiete