Überwachungsvorrichtung für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP4443123

Aktenzeichen

EP23166862

Anmeldetag

5. April 2023

Veröffentlichung

20. August 2025

Erteilung

20. August 2025

Rechtsraum

EP

IPC

G01K7/01G01K11/3213G01R31/26G01R31/308// G01N21/64G01N21/66G02B6/30G02B6/42

Abstract

The application discloses a monitoring device (1) for a semiconductor component (3) for an automobile appliance under high current and/or voltage, said semiconductor component (3) emitting photons at a light emitting surface (6) when biased, by way of electroluminescence or photoluminescence, in an amount depending on a temperature of and/or a current through the semiconductor component (3) and/or its gate voltage, wherein the semiconductor component (3) comprises particularly compound semiconductors such as silicon carbide, the monitoring device (1) including a light pipe insert (7) having a light receiving end (11) and a light emitting end (13), the light pipe insert (7) being formed and placed to receive photoluminescence light or electroluminescence light from the semiconductor component (3) through a light receiving surface (12) at the light receiving end (11) and to conduct the received light to the light emitting end (13) for detecting the temperature of the semiconductor component and/or or a current through the semiconductor component (3) and/or a gate voltage of the semiconductor component (3) through an optical sensor (17) coupled to the light emitting end (13) of the light pipe insert (7). A semiconductor device for an automobile appliance having the monitoring device (1) and a method for manufacturing the same are also disclosed.

Anmelder

Firmen

Bayerische Motoren Werke Aktiengesellschaft
Compound Semiconductor Applications Catapult Limited
University of Warwick

Land

🇩🇪 Deutschland

Fachgebiete