Hermetische Umfassung mit Glasdurchgängen und Medizinisches Implantat mit einer Solchen Hermetischen Umfassung

Details

Veröffentlichungs-Nr.

EP4487903

Aktenzeichen

EP23184167

Anmeldetag

7. Juli 2023

Veröffentlichung

4. Juni 2025

Erteilung

4. Juni 2025

Rechtsraum

EP

IPC

H01L23/055A61N1/375H01L23/10

Abstract

A hermetic enclosure (10) is provided comprising at least one glass substrate (12) having at least one electrical feedthrough configured as a through glass via (30), the via comprising a conductive rod (32) electrically connecting the inside of the hermetic enclosure (10) to the outside through the glass substrate (12), wherein the part of the conductive rod's (32) surface facing towards the outside of the hermetic enclosure (10) is completely covered with an electrically conductive coating (40), wherein the electrically conductive coating (40) is a multilayer structure comprising at least an adhesion layer (42) in direct contact with the conductive rod (32) and a corrosion resistant layer.

Anmelder

Firmen

SCHOTT AG
Schott Primoceler Oy

Land

🇩🇪 Deutschland

Fachgebiete