Vorrichtung zur Wärmeversorgung

Details

Veröffentlichungs-Nr.

EP4495510

Aktenzeichen

EP24189190

Anmeldetag

17. Juli 2024

Veröffentlichung

12. März 2025

Rechtsraum

EP

IPC

F25B13/00F25B43/00

Abstract

The present disclosure relates to a heat supply apparatus. The heat supply apparatus according to the present disclosure comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and air; and a gas-liquid separator located upstream of the compressor in a refrigerant flow path and separating introduced refrigerant into gaseous refrigerant and liquid refrigerant, wherein the gas-liquid separator includes: a housing; and a penetration pipe passing through one side and the other side of the housing and including an inlet flow path through which mixed refrigerant flows in and an outlet flow path through which gaseous refrigerant flows out, wherein the penetration pipe includes: a first connecting hole formed on a surface and connecting the inlet flow path and the inside of the housing; a second connecting hole formed on a surface and connecting the outlet flow path and the inside of the housing; and a separation plate partitioning the inlet flow path and the outlet flow path.

Anmelder

Firma

LG Electronics Inc.

Land

🇰🇷 Südkorea

Fachgebiete