Überwachung eines Kühlsystems einer Leistungselektronischen Halbleitervorrichtung

Details

Veröffentlichungs-Nr.

EP4502562

Aktenzeichen

EP23188646

Anmeldetag

31. Juli 2023

Veröffentlichung

21. Januar 2026

Erteilung

21. Januar 2026

Rechtsraum

EP

IPC

G01K7/01G01K7/22G01K3/14

Abstract

In order to enhance performance of power electronics such as a power switch or a power module, the invention provides a Monitoring method for monitoring a cooling system (18) of a power electronic semiconductor device (14) that includes the cooling system (18) and at least one semiconductor die (20) including a power switching element (22), comprising:a) measuring a first temperature (T1) by means of a temperature sensor (42) of the power electronic semiconductor device (14) wherein the temperature sensor (42) is arranged in a distance to the at least one semiconductor die (20),b) measuring an actual junction temperature of the at least one semiconductor die (20) as a second temperature (T2), andc) comparing the first and second temperatures (T1, T2) for determining a health status of the cooling system (18).

Anmelder

Firma

Airbus S.A.S.

Land

🇫🇷 Frankreich

Fachgebiete