Gehäuseinterne Antennenkonstruktion mit Frequenzduplextechnologie

Details

Veröffentlichungs-Nr.

EP4507120

Aktenzeichen

EP23203470

Anmeldetag

13. Oktober 2023

Veröffentlichung

12. Februar 2025

Rechtsraum

EP

IPC

H01Q1/22H10W42/20H10W44/20H01Q1/52H01Q5/42H01Q21/06

Abstract

An antenna-in-package construction includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant more than 3.5. The antenna-in-package construction includes a transmitting antenna array, a receiving antenna array, and metal isolated pillars. The transmitting antenna array extends from the chip layer to the first dielectric layer through the second dielectric layer. The receiving antenna array extends from the chip layer to the second dielectric layer. The transmitting antenna array and the receiving antenna array are arranged in an alternating interleaved sequence. The metal isolated pillars surround each transmitting antenna and each receiving antenna. The chip layer includes at least one transmitting chip and at least one receiving chip. The transmitting chip and the receiving chip are electrically connected to the transmitting antenna array and the receiving antenna array, respectively.

Anmelder

Firma

Industrial Technology Research Institute

Land

🇹🇼 Taiwan

Fachgebiete