Verfahren und Vorrichtung zur Schätzung von Zyklischer Thermischer Belastung

Details

Veröffentlichungs-Nr.

EP4513203

Aktenzeichen

EP23193502

Anmeldetag

25. August 2023

Veröffentlichung

26. Februar 2025

Rechtsraum

EP

IPC

G01R31/26G01R31/28

Abstract

A method and apparatus for estimating a cyclic thermal stress of a power semiconductor device, the apparatus (20) being configured to receive temperature data indicative of a temperature relating to the power semiconductor device (10), extract, from the received temperature data, thermal cycle data on characteristic quantities of one or more thermal cycles of the power semiconductor device (10), determine a thermal cycling operating point of the power semiconductor device (10) on the basis of the extracted thermal cycle data, and determine an estimate of the cyclic thermal stress of the power semiconductor device (10) on the basis of the determined thermal cycling operating point of the power semiconductor device and a cyclic thermal stress model of the power semiconductor device, wherein the cyclic thermal stress model comprises data indicative of a stress level of the power semiconductor device at predetermined thermal cycling operating points of the power semiconductor device.

Anmelder

Firma

ABB SCHWEIZ AG

Land

🇨🇭 Schweiz

Fachgebiete