Bipolartransistor und Verfahren zur Herstellung eines Bipolartransistors
Anmelder: NXP B.V. 🇳🇱
Details
- Veröffentlichungs-Nr.
- EP4525047
- Aktenzeichen
- EP23197929
- Anmeldetag
- 18. September 2023
- Veröffentlichung
- 18. Februar 2026
- Erteilung
- 18. Februar 2026
- Rechtsraum
- EP
- IPC
- H10D10/01H10D10/80H10D62/17
Abstract
A bipolar transistor and a method of making a bipolar transistor. The method includes providing a semiconductor substrate having a major surface, one or more layers located beneath the major surface for forming an intrinsic base, and a collector. The method also includes depositing a first oxide layer on the major surface, depositing a second oxide layer on the first oxide layer, and depositing an extrinsic base layer on the second oxide layer. The method further includes forming an emitter window through the extrinsic base layer. The method also includes removing at least a part of the second oxide layer to form a first cavity and forming an initial part of a base link region in the first cavity. The method also includes removing at least a part of the first oxide layer to form a second cavity and filling the second cavity to form a completed base link region.
Anmelder
- Firma
- NXP B.V.
- Land
- 🇳🇱 Niederlande
Niederländischer Halbleiterhersteller mit Sitz in Eindhoven. Entwickelt Chips und Halbleiterlösungen für Automobiltechnik, Kommunikation, Sicherheit sowie industrielle Anwendungen.
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