Multidirektionales Teilen und Multiplexen für Speicher mit Hoher Bandbreite

Details

Veröffentlichungs-Nr.

EP4546341

Aktenzeichen

EP24208876

Anmeldetag

25. Oktober 2024

Veröffentlichung

30. April 2025

Rechtsraum

EP

IPC

G11C5/02G11C5/06H01L23/48H01R12/52

Abstract

Generally disclosed herein are electronic circuits with high bandwidth interfaces (HBI) for multi-directional die-to-die communications. The HBIs are designed to allow for sharing of data between all sides of the memory chiplets. By using all sides of the memory chiplets and multiplexing the data between the multiple connected chiplets, the total bandwidth of the memory available to the connected chiplets can increase. The sharing and multiplexing of the data can also be dynamically configured to accommodate various options for the allocation of performance levels and the associated cost.

Anmelder

Firma

Google LLC

Land

🇺🇸 USA

Fachgebiete