Gehäusekonfiguration für Hochspannungs-Gate-Treiber mit einem Transformator

Details

Veröffentlichungs-Nr.

EP4546423

Aktenzeichen

EP24197714

Anmeldetag

30. August 2024

Veröffentlichung

9. Juli 2025

Rechtsraum

EP

IPC

H01L25/11H01L23/31H01L23/495H01L23/64H01L25/065H10D1/20H01L25/10H01L25/16

Abstract

According to one aspect of the present disclosure, a voltage isolated integrated circuit (IC) package configuration includes a first package comprising a transformer and a mold material enclosing the transformer to form a first package body, wherein the first package comprises a first lead set to permit electrical connection to the transformer. In some embodiments, a second package comprising a lead frame, two or more semiconductor die supported by the lead frame, and a mold material enclosing the two or more semiconductor die to form a second package body, wherein the lead frame comprises a second lead set to permit electrical connection to the two or more semiconductor die. In some embodiments, the one or more leads of the first lead set is directly electrically connected to one or more leads of the second lead set, wherein the first package and the second package are mechanically coupled together.

Anmelder

Firma

Allegro MicroSystems, LLC

Land

🇺🇸 USA

Fachgebiete