Vorrichtung und Verfahren zur Elektrodenplattenverarbeitung

Details

Veröffentlichungs-Nr.

EP4549114

Aktenzeichen

EP24196858

Anmeldetag

28. August 2024

Veröffentlichung

7. Mai 2025

Rechtsraum

EP

IPC

B26F1/40B21D28/04H01M4/02

Abstract

An electrode plate processing apparatus includes: a punch configured to cut an electrode plate; a die configured to seat the electrode plate thereon and accommodating the punch; a pressure measurement member on at least one of the punch or the die, and configured to measure a pressure applied to the punch or the die in a process in which the punch is lowered; a clearance adjustment unit on the die, and configured to adjust a clearance between the punch and the die by pressing the punch; and a control unit configured to control an operation of the clearance adjustment unit based on the pressure measured by the pressure measurement member.

Anmelder

Firma

SAMSUNG SDI CO., LTD.

Land

🇰🇷 Südkorea

Fachgebiete