Erweitertes Verbindungsverfahren für Hochfrequenz-Aesa-Antenne

Details

Veröffentlichungs-Nr.

EP4557357

Aktenzeichen

EP24212523

Anmeldetag

12. November 2024

Veröffentlichung

27. August 2025

Rechtsraum

EP

IPC

H01L23/00H01L23/31H01L23/66H01L25/18H01Q1/22// H01L23/498H01L25/16H01L25/065H01Q3/00H01Q21/00H03F3/189

Abstract

An electronic package includes multiple separate circuit cards. An unbalanced, single circuit card is separated into multiple individual circuit cards with balanced stacks. The beamforming circuitry and antenna may be embodied in separate circuit cards. The beamforming circuitry and amplifiers may include pads for electronic connectivity on both a top surface and a bottom surface. Internal vias create electronic connectivity between the top surface and bottom surface. An antenna card may connect to the beamforming circuitry via pads on the top surface of the circuitry card.

Anmelder

Firma

Rockwell Collins, Inc.

Land

🇺🇸 USA

Fachgebiete