Duale Einachsige Dehnung in Bandförmigen Kanälen

Details

Veröffentlichungs-Nr.

EP4568449

Aktenzeichen

EP24210233

Anmeldetag

31. Oktober 2024

Veröffentlichung

6. August 2025

Rechtsraum

EP

IPC

H10D84/01H10D84/85H10D30/00H10D30/69H10D64/01

Abstract

An integrated circuit structure includes laterally adjacent first and second devices. The first device includes (i) a first source or drain region having a first plurality of portions, (ii) a first plurality of bodies, each body of the first plurality of bodies laterally extending from a corresponding one of the first plurality of portions, and (iii) a first source or drain contact including a first conductive material and coupled to the first plurality of portions. The second device includes (i) a second source or drain region having a second plurality of portions, (ii) a second plurality of bodies, each body of the second plurality of bodies laterally extending from a corresponding one of the second plurality of portions, and (iii) a second source or drain contact coupled to the second plurality of portions and including a second conductive material elementally different from the first conductive material.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA

Fachgebiete