Elektrodenplattenstapelvorrichtung und Elektrodenplattenstapelverfahren damit

Details

Veröffentlichungs-Nr.

EP4636882

Aktenzeichen

EP25169764

Anmeldetag

10. April 2025

Veröffentlichung

22. Oktober 2025

Rechtsraum

EP

IPC

H01M10/04H01M10/0525H01M10/0583H01M50/46

Abstract

Provided are an electrode plate stacking apparatus (1000), another electrode plate stacking apparatus (2000) and an electrode plate stacking method using the same. The electrode plate stacking apparatus (1000) and the other electrode plate stacking apparatus (2000) respectively comprise rotary plates. The rotary plates (200, 300) of the electrode plate stacking apparatus (1000), while rotating, place the electrode plates (P, N) onto each other and press the electrode plates (P, N) against each other to cause the electrode plates (P, N) to bond with each other via a surface coated adhesive. The rotary plates (200a, 300a) of the other electrode plate stacking apparatus (2000), while rotating, fold a separator (S) and press an electrode plate (P, N) onto a folded portion (FP1) of the separator (S).

Anmelder

Firma

Samsung SDI Co., Ltd.

Land

🇰🇷 Südkorea

Fachgebiete