Ic-Modul und Ic-Karte

Details

Veröffentlichungs-Nr.

EP4711980

Anmeldetag

30. April 2024

Veröffentlichung

14. November 2024

Rechtsraum

EP

Abstract

An IC module according to the present invention includes a rectangular substrate having long sides extending in a first direction; a connection coil formed in a spiral shape on a first surface of the substrate; an outermost connection terminal portion formed at an outermost end of the connection coil; and an IC chip provided on a portion of the first surface on an inner peripheral side relative to the connection coil, wherein the outermost connection terminal portion includes an outermost through-hole portion penetrating the substrate in a thickness direction of the substrate, and an outermost land portion surrounding the outermost through-hole portion and connecting between the outermost through-hole portion and the connection coil; and as viewed in a second direction perpendicular to both the first direction and the thickness direction, the outermost connection terminal portion is disposed on a first side in the first direction relative to the IC chip.

Anmelder

Firma

Toppan Holdings Inc.

Land

🇯🇵 Japan