Verfahren und Vorrichtung zur Stromversorgung durch Verpackungssubstrate mit Stapeln von Glasschichten mit Verschiedenen Wärmeausdehnungskoeffizienten

Details

Veröffentlichungs-Nr.

EP4712114

Anmeldetag

12. August 2025

Veröffentlichung

18. März 2026

Rechtsraum

EP

IPC

H01F17/00

Abstract

Systems, apparatus, articles of manufacture, and methods for power delivery through package substrates with stacks of glass layers having different coefficients of thermal expansion are disclosed. An example substrate for an integrated circuit package includes: a first glass layer having a first coefficient of thermal expansion (CTE); a second glass layer having a second CTE, the second CTE different from the first CTE; a conductive material extending through a first hole in the first glass layer and a second hole in the second glass layer; and a magnetic material between an inner wall of the first hole and the conductive material.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA