Antennensubstrat

Details

Veröffentlichungs-Nr.

EP4712270

Anmeldetag

19. April 2024

Veröffentlichung

21. November 2024

Rechtsraum

EP

IPC

H01Q23/00, H01Q1/52, H01Q13/08

Abstract

According to the present invention, an antenna substrate includes a core layer, a first buildup layer laminated on one surface of the core layer and a second buildup layer laminated on the other surface of the core layer. An antenna is formed on the first buildup layer. A high-frequency integrated circuit (IC) is mounted on the second buildup layer. A ground layer formed away from the antenna in a thickness direction and a power-supply wiring layer formed on an opposite side of the antenna with respect to the ground layer in the thickness direction are provided in an inner layer of the core layer. The core layer includes a first through-hole via configured to pass through the core layer in the thickness direction from the one surface to the other surface and electrically connect the power-supply wiring layer and the high-frequency integrated circuit (IC).

Anmelder

Firma

Fujikura Ltd.

Land

🇯🇵 Japan