Systeme, Komponenten und Mechanismen zur Unterstützung der Elektrischen Signalübertragung in Umgebungen mit Niedriger Temperatur

Details

Veröffentlichungs-Nr.

EP4712704

Anmeldetag

17. September 2024

Veröffentlichung

18. März 2026

Rechtsraum

EP

Abstract

Electrical communication between a sample (such as a quantum chip, semiconductor sample etc.) in a low temperature environment and an external device is effected via signal lines printed on rigid printed circuit board (PCB) located within a region of the low temperature environment (e.g., a non-uniform magnetic field region). One example application is performing a measurement of an electrical property of the sample at a low signal frequency with a short measurement integration time, although the subject matter is not limited in this respect. Another application is routing an electrical control signal to the sample.

Anmelder

Firma

Microsoft Technology Licensing, LLC

Land

🇺🇸 USA