Routing eines Entkopplungskondensators mit Hoher Dichte zur Optimierung der Kapazität in der Herstellung mit Hoher Ausbeute

Details

Veröffentlichungs-Nr.

EP4712707

Anmeldetag

10. September 2025

Veröffentlichung

18. März 2026

Rechtsraum

EP

Abstract

A multi-layer printed circuit board includes a substrate having a first side and a second side opposite the first side, a central via pad disposed on the first side and having a plurality of central-extensions extending outwardly therefrom, a first via pad disposed on the first side and having at least one first-extension extending outwardly therefrom, a second via pad disposed on the first side and having at least one first-extension extending outwardly therefrom, wherein each central-extension has a first-connection-edge, wherein each first-extension has a second-connection-edge, wherein a first first-connection edge of a first central-extension faces a second-connection-edge of the first via pad, and a line perpendicular to the first first-connection edge and to the second-connection-edge of the first via pad forms an angle with a via-to-via axis line between the central via pad and the first via pad, and the angle is greater than a predetermined threshold angle.

Anmelder

Firma

Nokia Solutions and Networks Oy

Land

🇫🇮 Finnland