Expandierbare Wärmehärtbare Epoxidharzzusammensetzung mit Verbesserter Duktilität

Details

Veröffentlichungs-Nr.

EP4714993

Anmeldetag

23. September 2024

Veröffentlichung

25. März 2026

Rechtsraum

EP

IPC

(MUENZ XAVER et al.)

Abstract

The present invention relates to a one-component thermosetting epoxy resin composition, comprising a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; c) at least one physical or chemical blowing agent BA; d) at least one core-shell polymer D1; e) at least one cross linked acrylonitrile-butadiene copolymer and f) polyvinyl butyral. The epoxy resin adhesive is notable for the improved ductility and storage stability.

Anmelder

Firma

Sika Technology AG

Land

🇨🇭 Schweiz