Systeme und Verfahren für Mehrschichtige Optische Näherungskorrekturmetrologie unter Verwendung Elektrischer Testdaten

Details

Veröffentlichungs-Nr.

EP4715464

Anmeldetag

13. August 2025

Veröffentlichung

25. März 2026

Rechtsraum

EP

IPC

G03F1/36

Abstract

Systems and methods for multi-layer optical proximity correction (OPC) metrology. The OPC metrology system accesses three layers of OPC contour data, the layers of OPC data generated for a drawn integrated circuit layout characterized for a foundry process node. The three layers include a first metal layer, a second metal layer, and a via layer. A feature, such as a via, is formed in the three layers. The system receives user input defining a check (geometric analysis) for the feature, and a limit. The system performs the check on the features and generates a flag for the feature when the limit is exceeded. The system can generate output that reflects the integration of multiple checks and predicts risks and yields for the foundry process node.

Anmelder

Firma

INTEL Corporation

Land

🇺🇸 USA