Arraysubstrat und Anzeigevorrichtung

EP4715876 5. Dezember 2024

Anmelder: Boe Technology Group Co., Ltd., Beijing BOE Technology Development Co., Ltd. 🇨🇳

Details

Veröffentlichungs-Nr.
EP4715876
Anmeldetag
23. Februar 2024
Veröffentlichung
5. Dezember 2024
Rechtsraum
EP
Offizieller Volltext

Abstract

An array substrate. The array substrate comprises a base substrate, a signal line, a first insulating layer, an active layer and a first via hole, wherein the signal line is located on the base substrate; the first insulating layer is located on the side of the signal line away from the base substrate; the active layer is located on the side of the first insulating layer away from the base substrate, and comprises a first portion, a second portion, and a channel structure, which is located between the first portion and the second portion; the first via hole penetrates at least the first insulating layer, and exposes at least part of the signal line; the first portion is configured to connect to the signal line by means of the first via hole; the materials of the second portion and the first portion are the same as the material of the channel structure; and the electrical conductivity of the channel structure is different from that of the first portion, and is different from that of the second portion.

Anmelder

Firmen
Boe Technology Group Co., Ltd.
Beijing BOE Technology Development Co., Ltd.
Land
🇨🇳 China
🇨🇳 BOE Technology

Chinesischer Elektronikkonzern mit Sitz in Peking, entwickelt und fertigt Display-Technologien wie LCD- und OLED-Bildschirme für Endgeräte und Industrieanwendungen.

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