Arraysubstrat und Anzeigevorrichtung
Anmelder: Boe Technology Group Co., Ltd., Beijing BOE Technology Development Co., Ltd. 🇨🇳
Details
- Veröffentlichungs-Nr.
- EP4715876
- Anmeldetag
- 23. Februar 2024
- Veröffentlichung
- 5. Dezember 2024
- Rechtsraum
- EP
Abstract
An array substrate. The array substrate comprises a base substrate, a signal line, a first insulating layer, an active layer and a first via hole, wherein the signal line is located on the base substrate; the first insulating layer is located on the side of the signal line away from the base substrate; the active layer is located on the side of the first insulating layer away from the base substrate, and comprises a first portion, a second portion, and a channel structure, which is located between the first portion and the second portion; the first via hole penetrates at least the first insulating layer, and exposes at least part of the signal line; the first portion is configured to connect to the signal line by means of the first via hole; the materials of the second portion and the first portion are the same as the material of the channel structure; and the electrical conductivity of the channel structure is different from that of the first portion, and is different from that of the second portion.
Anmelder
- Firmen
- Boe Technology Group Co., Ltd.
Beijing BOE Technology Development Co., Ltd. - Land
- 🇨🇳 China
Chinesischer Elektronikkonzern mit Sitz in Peking, entwickelt und fertigt Display-Technologien wie LCD- und OLED-Bildschirme für Endgeräte und Industrieanwendungen.
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Vertreten von
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Hoffmann Eitle
Hoffmann Eitle · München