Leiterverbindungsstruktur

EP4716015 25. März 2026

Anmelder: Yazaki Corporation 🇯🇵

Details

Veröffentlichungs-Nr.
EP4716015
Anmeldetag
22. September 2025
Veröffentlichung
25. März 2026
Rechtsraum
EP
IPC
(BECKER FRANCK et al.)
Offizieller Volltext

Abstract

A conductor connecting structure (1) includes a first conductor (2) including a conductor portion (20) including an end portion having a plate-like shape, and a second conductor (3) including a conductor portion (30) including an end portion having a plate-like shape. A width dimension and a thickness dimension at the end portion of the conductor portion of the first conductor are substantially the same as a width dimension and a thickness dimension at the end portion of the conductor portion of the second conductor, respectively. An end surface at the end portion of the conductor portion of the first conductor and an end surface at the end portion of the conductor portion of the second conductor are joined together by a joint portion (4), and the end portion of the conductor portion of the first conductor and the end portion of the conductor portion of the second conductor are not joined together in a state of being stacked on each other in a thickness direction. In a plan view of the first conductor and the second conductor, a total line length (W1) of the joint portion is 1.7 times or more than the shorter one of the width dimension (W2) at the end portion of the conductor portion of the first conductor and the width dimension (W3) at the end portion of the conductor portion of the second conductor.

Anmelder

Firma
Yazaki Corporation
Land
🇯🇵 Japan
🇯🇵 Yazaki

Japanisches Unternehmen, das Kabelbäume, Steckverbinder und elektrische Bordnetzsysteme vor allem für die Automobilindustrie entwickelt und herstellt.

3.917 Patente in unserer Datenbank

Noch Fragen?

Wir helfen Ihnen gerne weiter. Schreiben Sie uns einfach.

Kontakt aufnehmen