Verfahren zur Herstellung eines Rückseitigen Source/drain-Kontaktes
Anmelder: Imec VZW 🇧🇪
Details
- Veröffentlichungs-Nr.
- EP4716404
- Anmeldetag
- 24. September 2024
- Veröffentlichung
- 25. März 2026
- Rechtsraum
- EP
Abstract
According to an aspect of the present inventive concept there is provided a method for forming a source/drain contact, the method comprising: providing at least one fin (110) on top of a substrate (130), the at least one fin (110) comprising at least a first set of channel layers (111), the at least one fin (110) being arranged between a first and second shallow trench isolation, STI, region (151, 152) extending into the substrate (130); from a frontside (134) of the substrate (130): forming a cavity (136) in the substrate (130) proximate to the at least one fin (110), forming a sacrificial plug (160) in the cavity (136), and forming a source/drain region (170) on top of the sacrificial plug (160), and in contact with the first set of channel layers (111) of the at least one fin (110); and from a backside (135) of the substrate (130): removing a first region (138) of the substrate (130), the first region (138) of the substrate (130) being a region between the first and second STI region (151, 152) and around the sacrificial plug (160), forming a dielectric material (180) between the first and second STI region (151, 152) and around the sacrificial plug (160), and replacing the sacrificial plug (160) with a metal (190) such that the metal (190) is in electrical contact with the source/drain region (170), wherein a bottom level of the cavity (136) is substantially equal to a bottom level of the first and second STI region (151, 152).
Anmelder
- Firma
- Imec VZW
- Land
- 🇧🇪 Belgien
Imec ist ein belgisches Forschungszentrum mit Sitz in Leuven, das auf Nanoelektronik, Halbleitertechnologie und digitale Technologien spezialisiert ist.
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