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Anmelder: ALPS ALPINE CO., LTD. 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4716428
- Anmeldetag
- 11. August 2025
- Veröffentlichung
- 25. März 2026
- Rechtsraum
- EP
- IPC
- (KIM DAEWON et al.)
Abstract
A multilayer board structure includes a plurality of light emitting devices, each light emitting device of the plurality of light emitting devices having a plurality of electrodes formed on a terminal surface thereof, and a multilayer board including a plurality of stacked substrates and implemented with the plurality of light emitting devices. An uppermost substrate of the plurality of stacked substrates has a surface formed with metal layers coupling electrodes of the plurality of light emitting devices. Remaining substrates of the plurality of stacked substrates, other than the uppermost substrate, have surfaces formed with metal layers, respectively. A number of metal layers located directly below the electrodes of the plurality of light emitting devices is the same for each of the electrodes.
Anmelder
- Firma
- ALPS ALPINE CO., LTD.
- Land
- 🇯🇵 Japan
Japanischer Hersteller elektronischer Komponenten mit Sitz in Tokio, unter anderem für Sensoren, Schalter und Automobilelektronik, entstanden 2019 aus dem Zusammenschluss von Alps Electric und Alpine Electronics.
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