Ic-Gehäuse mit Substraten mit Glaskernen mit Grosser Grundfläche, Dünnen Umverteilungsschichten und Elektrischen Komponenten

Details

Veröffentlichungs-Nr.

EP4716450

Anmeldetag

22. August 2025

Veröffentlichung

25. März 2026

Rechtsraum

EP

Abstract

An apparatus comprises a first IC die over a substrate comprising a glass core. The glass core comprises a first surface and a second surface opposite the first surface. The first surface comprises an area of at least 5,000 mm². A redistribution layer is on the first surface. The redistribution layer comprises a thickness of 100 µm or less. An electrical component is within a region of the glass core between the first and second surfaces. A through-glass via extends between the first and second surfaces. A second IC die is over and directly bonded to the first IC die.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA