Fabrikbodenmodellierung
Anmelder: INTEL Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4718309
- Anmeldetag
- 20. August 2025
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
- IPC
- G06F30/13, G06F30/27, G06N3/08
Abstract
System and techniques for facility floor modeling are described herein. A scan set that includes depth data and correlated image data from various positions on a facility floor is obtained. This data includes representations of equipment in the factory. A trained model is invoked, receiving the scan set as input and producing, as output, a computer model of the equipment along with associated information. The computer model of the equipment is integrated into a larger computer model of the factory and the information regarding the equipment is stored in a data structure that corresponds to the equipment's representation within the computer model of the factory.
Anmelder
- Firma
- INTEL Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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