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Anmelder: Intel Corporation 🇺🇸
Details
- Veröffentlichungs-Nr.
- EP4718456
- Anmeldetag
- 20. August 2025
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
Abstract
Embodiments herein relate to Static Random-Access Memory (SRAM) where a column of cells includes first and second sets of bit lines. First and second pre-charge circuits are also provided to allow independent precharging of the sets of bit lines such as for write or read operations. For a read operation, a sense circuit for the column is coupled to one of the sets of bit lines by a multiplexer. The SRAM can be implemented using complementary field-effect transistor (CFET) technology, where n-type and p-type transistors are arranged in a stacked configuration on top and bottom levels, respectively of a stack. Additionally, the first and second sets of bit lines can be provided in top and bottom metal layers, respectively, of the stack. In another option, a third set of bit lines is provided using an intermediate metal layer.
Anmelder
- Firma
- Intel Corporation
- Land
- 🇺🇸 USA
US-amerikanischer Halbleiterhersteller mit Sitz in Kalifornien. Entwickelt und produziert Prozessoren, Chipsätze sowie weitere Halbleiterkomponenten für Computer, Server und eingebettete Systeme.
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