Modulares Verbindergehäuse, Satz zur Montage eines Modularen Verbindergehäuses, Modularer Verbinder und Verfahren zur Herstellung von Modularen Verbindergehäusen
EP4718637
1. April 2026
Anmelder: Yazaki Europe Ltd. 🇬🇧
Details
- Veröffentlichungs-Nr.
- EP4718637
- Anmeldetag
- 27. September 2024
- Veröffentlichung
- 1. April 2026
- Rechtsraum
- EP
- IPC
- H01R13/514, H01R13/518(LIN SHUNHUA et al.)
Abstract
Modular connector housing comprising a frame forming an outer perimeter and receiving cavities for receiving modules with terminals, set for assembling a modular connector housing, modular connector with the modular connector housing, a frame, a plurality of modules for receiving the terminals being inserted into the receiving cavities, and process for manufacturing modular connector housings.
Anmelder
- Firma
- Yazaki Europe Ltd.
- Land
- 🇬🇧 Großbritannien