Kühlvorrichtung und Pcb-Gehäuse damit

Details

Veröffentlichungs-Nr.

EP4718959

Anmeldetag

25. September 2024

Veröffentlichung

1. April 2026

Rechtsraum

EP

IPC

H05K7/20

Abstract

A cooling device (11), comprised of an extruded aluminium profile, has a plurality of longitudinal channels (17) formed therethrough by the extrusion process. The device may serve as an outer wall/lid for a PCB housing (10). The profile (11) includes internally facing projections (18b), e.g. by making impressions (18a) into the opposite surface, located coincident with the channels. The configuration enables contact with electronic components of varying height from a circuit board (14). In use, liquid coolant passing through the channels (17), behind the projections (18b), transfers heat away from electronic components (19) of the PCB (14).

Anmelder

Firma

Aptiv Technologies AG

Land

🇨🇭 Schweiz