Integrierte Schaltungsanordnung mit Interposer zwischen Gestapeltem Chip und Zugehörige Verfahren

Details

Veröffentlichungs-Nr.

EP4719032

Anmeldetag

19. September 2025

Veröffentlichung

1. April 2026

Rechtsraum

EP

Abstract

An integrated circuit (IC) assembly 50 may include stacked IC die 51a-51e and a respective interposer 20 between adjacent ones of the stacked die. Each interposer 20 may include an interposer bottom 21 and an interposer top 22 coupled thereto and defining a heat exchange fluid chamber 23 therebetween. Each interposer may also include interposer dielectric pillars 24a, 24b extending within the heat exchange fluid chamber 23 between the interposer bottom 21 and the interposer top 22, and a heat exchange fluid 25 within the heat exchange fluid chamber. Each interposer 20 may also include a wick structure 26 within the heat exchange fluid chamber 23 for moving the heat exchange fluid 25 in a liquid phase into the heat exchange fluid chamber 23, and electrically conductive through-vias 27 extending within respective ones of the interposer dielectric pillars 24a, 24b and being exposed on outer surfaces of the interposer bottom 21 and the interposer top 22.

Anmelder

Firma

Eagle Technology, LLC

Land

🇺🇸 USA