Verfahren zur Herstellung von Verpackungsstrukturen mit einer Hermetischen Kompressionsdeckschicht zur Deckelbefestigung mit Lückenfülloxid

Details

Veröffentlichungs-Nr.

EP4719034

Anmeldetag

18. August 2025

Veröffentlichung

1. April 2026

Rechtsraum

EP

Abstract

Microelectronic integrated circuit package structures include a package structure comprising a first die on a first dielectric material and a second die on second dielectric material, where the first die is adjacent to the second die. A third die is below the first die and is hybrid bonded to the first die. a fourth die is below the second die, and is hybrid bonded to the second die. A layer comprising nitrogen and silicon is directly on top surfaces of the first die and the second die. A fill dielectric material is between the first die and the second die, and a lid over the fill dielectric material.

Anmelder

Firma

Intel Corporation

Land

🇺🇸 USA