Verklebte Struktur mit einer Elektrochemisch Ablösbaren Klebeschicht

Details

Veröffentlichungs-Nr.

EP4721970

Anmeldetag

1. Oktober 2024

Veröffentlichung

8. April 2026

Rechtsraum

EP

IPC

(EIC LAB INC et al.)

Abstract

A bonded structure comprising: a first substrate; a second substrate; and, a substructure. The substructure comprises: a first planar plate having an outer surface and being provided with an electrically conductive inner surface; a second planar plate having an outer surface and being provided with an electrically conductive inner surface; and, a layer of electrochemically debondable adhesive interposed between said electrically conductive inner surfaces of the first and second planar plates, said adhesive having electrolyte functionality and comprising a non-polymerizable electrolyte and a cured resinous matrix (M<R>). The bonded structure further comprises: a layer of a first fixative interposed between the outer surface of the first planar plate of the substructure and the first substrate; and, a layer of a second fixative interposed between the outer surface of the second planar plate of the substructure and the second substrate.

Anmelder

Firma

Henkel AG & Co. KGaA

Land

🇩🇪 Deutschland