Verfahren zum Verbinden einer Leitfähigen Schicht mit einem Substrat

Details

Veröffentlichungs-Nr.

EP4721974

Anmeldetag

2. Oktober 2024

Veröffentlichung

8. April 2026

Rechtsraum

EP

Abstract

The present invention relates to a method for bonding a conductive member to a substrate providing a conductive path in aircraft components. The method comprises providing a substrate comprising a top layer with a primary conductive member, providing a secondary conductive member on the top layer, providing a surface structured layer between the primary conductive member and the secondary conductive member, bonding the secondary conductive member to the top layer by means of the surface structured layer to conductively couple the primary conductive member and the secondary conductive member. Also disclosed is a conductive component comprising materially and conductively bonded primary and secondary conductive members.

Anmelder

Firmen

Airbus (S.A.S.)
NanoWired GmbH

Land

🇫🇷 Frankreich