Verfahren und Vorrichtung zur Herstellung einer Kardenkörperschicht für eine Chipkarte sowie Chipkarte und Bausatz mit einer Transparenten Holzschicht

Details

Veröffentlichungs-Nr.

EP4722976

Anmeldetag

1. Oktober 2024

Veröffentlichung

8. April 2026

Rechtsraum

EP

IPC

(CHANANA MUNISH et al.)(PATOUR SÉBASTIEN et al.)(PACHLER WALTHER et al.)(THALES DIS FRANCE SA et al.)(LI YUANYUAN et al.)

Abstract

Method and manufacturing device (20) of manufacturing a body layer (10) of a card body (2), in particular for a chip card (1), such as a transaction card having a chip module (3) enabling electronic transactions, as well as a corresponding card body (2), chip card (1), use of a wooden layer (W) to form at least a part of a body layer (10) of a card body (2) and a construction kit for a card body (2) are provided, the method comprising the steps of providing a wooden layer (W) to form at least a part of the body layer (10); and adapting the wooden layer (W) to be transparent in at least one transparent section (T).

Anmelder

Firma

Giesecke+Devrient ePayments GmbH

Land

🇩🇪 Deutschland