Verfahren zur Herstellung eines Galliumnitrid-Lichtemissionselements und Beleuchtungsvorrichtung
Anmelder: Nitride Semiconductors Co., Ltd., NIKON CORPORATION 🇯🇵
Details
- Veröffentlichungs-Nr.
- EP4723178
- Anmeldetag
- 28. Mai 2024
- Veröffentlichung
- 5. Dezember 2024
- Rechtsraum
- EP
- IPC
- H01L33/46, G03F7/20, H01L33/32
Abstract
The present invention provides a method for manufacturing a GaN light emitting element having adjustable directional characteristics. The method comprises: a step in which an n-type GaN layer (12), an MQW layer (14), and a p-type GaN layer (16) are epitaxially grown in sequence on a sapphire substrate (10) so as to form an epitaxial structure; a step in which a p-type electrode, a metal reflective film, a metal substrate, and a support substrate are formed on the p-type GaN layer (16); a step in which the epitaxial structure is inverted vertically; a step in which the sapphire substrate (10) is separated so as to expose the n-type GaN layer (12) in the surface; a step in which the n-type GaN layer (12) exposed in the surface is etched so as to adjust a resonator length between the surface of the metal reflective film and the surface of the n-type GaN layer (12); and a step in which an n-electrode (24) is formed.
Anmelder
- Firmen
- Nitride Semiconductors Co., Ltd.
NIKON CORPORATION - Land
- 🇯🇵 Japan
Japanisches Technologieunternehmen mit Sitz in Tokio. Nikon entwickelt optische Geräte und Präzisionstechnik, darunter Kameras, Objektive, Mikroskope sowie Lithografie- und Messsysteme für die Halbleiterfertigung.
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