Sensorvorrichtung

Details

Veröffentlichungs-Nr.

EP4723840

Anmeldetag

3. September 2025

Veröffentlichung

8. April 2026

Rechtsraum

EP

IPC

H10F39/00, G03B17/55(MINAMIO MASANORI et al.)

Abstract

A sensor apparatus (1) includes a housing (4), a sensor component (9), a sensor substrate (10) carrying the sensor component, a cured paste (13) located on a surface of the sensor substrate that is adjacent to the housing, and a sheet member (7) located between the cured paste and the housing. The sensor substrate, the cured paste, the sheet member, and the housing are arranged in that order, and each of the sensor substrate, the cured paste, the sheet member, and the housing is in contact with an adjoining one of the sensor substrate, the cured paste, the sheet member, and the housing to transfer heat from the sensor substrate to the housing through the cured paste and the sheet member.

Anmelder

Firma

Canon Kabushiki Kaisha

Land

🇯🇵 Japan

Fachgebiete