Vorrichtung zur Prüfung der Haftfestigkeit und Verbundsystem

Details

Veröffentlichungs-Nr.

EP4725641

Anmeldetag

12. September 2025

Veröffentlichung

15. April 2026

Rechtsraum

EP

IPC

B23K31/12, H01M50/169

Abstract

The present disclosure relates to a bonding strength inspection apparatus capable of inspecting a bonding strength of a bonding part without destruct an inspection target. The present disclosure provides a bonding strength inspection apparatus (300) comprising: a roughness measurement part (310) configured to measure a roughness of a bonding part (W) in which a base metal and a bonding member are bonded to each other; and a processor (320) configured to determine a bonding strength of the bonding part (W) based on the roughness.

Anmelder

Firma

SAMSUNG SDI CO., LTD.

Land

🇰🇷 Südkorea