Wärmerohr, Wärmeableitungsvorrichtung und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4726315

Anmeldetag

7. August 2024

Veröffentlichung

20. März 2025

Rechtsraum

EP

IPC

F28D15/04, F28D15/02

Abstract

This application discloses a heat pipe, a heat sink, and an electronic device, where the heat pipe includes a pipe body, a first capillary structure, and a second capillary structure. The pipe body has an accommodation cavity therein, and the accommodation cavity is configured to seal a working fluid. The first capillary structure is attached to an inner pipe surface of the pipe body. The second capillary structure is wrapped inside the first capillary structure. According to the heat pipe in this application, the first capillary structure having a relatively large capillary pressure wraps the second capillary structure having a relatively large permeability, so that a composite capillary structure having a high-speed backflow channel is formed in the heat pipe. Therefore, advantages of different capillary structures are fully utilized, so that the working fluid in the heat pipe rapidly and fully participates in cyclic heat transfer in a liquid-vapor phase change, thereby improving heat transfer performance of the heat pipe.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China