Leiterplatte mit Halblötmaskendefiniertem Pad und Verfahren zur Herstellung davon

Details

Veröffentlichungs-Nr.

EP4727268

Anmeldetag

29. September 2025

Veröffentlichung

15. April 2026

Rechtsraum

EP

IPC

H05K1/11, H05K3/3452

Abstract

In accordance with various embodiments of the present disclosure, a circuit board is provided that comprises a substrate (202), a metal layer (204) covering a portion of the substrate and forming at least one metal pad, and a solder mask (206) at least partly covering the metal layer and defining at least one opening. The at least one opening corresponds to the at least one metal pad such that opposing first and second edges of the metal pad are exposed within the at least one opening and opposing third and fourth edges of the metal pad are covered by the solder mask.

Anmelder

Firma

STMicroelectronics International N.V.

Land

🇨🇭 Schweiz