Flexible Leiterplatte und Elektronische Vorrichtung

Details

Veröffentlichungs-Nr.

EP4727275

Anmeldetag

21. März 2024

Veröffentlichung

16. Januar 2025

Rechtsraum

EP

IPC

H05K7/14, H05K1/18

Abstract

This application provides a flexible printed circuit and an electronic device. The flexible printed circuit comprises at least one moving section arranged along its length direction. By providing a dividing groove in at least one moving section, the dividing groove divides the moving section into a first portion and a second portion. The dividing groove may absorb a deformation generated when the flexible printed circuit bends, and the first portion and the second portion are completely divided and do not affect each other, reducing the deformation of the first portion and the second portion, reducing the overall arching degree of the flexible printed circuit, and reducing the pressure exerted by the flexible printed circuit on adjacent components. As a result, issues such as abnormal pressing noise and film printing of the electronic device can be improved.

Anmelder

Firma

Honor Device Co., Ltd.

Land

🇨🇳 China